Hg Lamp with long UV wavelengths ideal for curing epoxy or applications requiring prolonged UV exposure. Protective UV shield and glasses available and required while in the immediate vicinity of the station.
Mask aligner used for transferring patterns using either standard UV or Deep UV wavelengths from masks onto substrates. Backside IR alignment capability. Substrates up to 150mm in diameter can be easily accommodated.
Used for aligning masks on wafers with photo-resist. Used for 2 and 3 inch wafers.
Used for non-critical image transfer and blanket exposure.
A reliable platform used in spin coating primers, photoresists, and polymer coatings located in the lithography area of our Class 100 cleanroom.
Located in our Cleanroom this system is capable of plasma etching and plasma cleaning substrates as large as 300mm (12") in diameter. It can etch silicon nitride, silicon dioxide, polysilicon, germanium and polymers. It can clean and remove photoresists and organic residues.
This furnace is used for annealing metallized substrates or samples where surface chemical contamination is not an issue. This tube can handle substrates less than 4" in diameter.
Located in our Class 100 cleanroom, the thermal oxidation furnace is primarily used for growing a thermal oxide layer on silicon or annealing clean substrates that have no exposed metal layers. Wafers and substrates less than 5" in diameter can be accommodated. Oxidation is performed at high temperatures of around 1000C either utilizing dry oxygen or wet utilizing a bubbler. No exposed metals are allowed inside the tube.
