Allows users to view samples and save digital images. Current objectives are 4X, 20X, 40X. Scope can accommodate any size sample and is connected to a computer with internet access. Tool can also be set up for parametric probing of devices.
An advanced profilometer capable of measuring surface morphology and film thickness as large as 200mm.
The CDE Resmap measures and displays thin-film resistivity, sheet resistance, and film thickness. Creates printable and exportable files and substrate apps.
Thickness and optical constants (n and k) and measured quickly and easily with the F20 advanced spectrometry system. Spectral analysis of reflectance from the top and bottom of the thin film provides thickness, refractive index, and extinction coefficient in less than a second. The entire desktop system sets up in minutes and can be used by anyone with basic computer skills.
A sturdy reliable profilometer used for measuring film thickness, step height, and surface morphology located inside our Class 100 cleanroom.
Hg Lamp with long UV wavelengths ideal for curing epoxy or applications requiring prolonged UV exposure. Protective UV shield and glasses available and required while in the immediate vicinity of the station.
Mask aligner used for transferring patterns using either standard UV or Deep UV wavelengths from masks onto substrates. Backside IR alignment capability. Substrates up to 150mm in diameter can be easily accommodated.
Used for aligning masks on wafers with photo-resist. Used for 2 and 3 inch wafers.
Used for non-critical image transfer and blanket exposure.
