KLA-Tencor P15
An advanced profilometer capable of measuring surface morphology and film thickness as large as 200mm.
- Manual (PDF) chapters 1-5 | chapters 6-10 | chapters 11-15
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Nanofabrication Core Facility
CDE Resmap
The CDE Resmap measures and displays thin-film resistivity, sheet resistance, and film thickness. Creates printable and exportable files and substrate apps.
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Filmetrics F20
Thickness and optical constants (n and k) and measured quickly and easily with the F20 advanced spectrometry system. Spectral analysis of reflectance from the top and bottom of the thin film provides thickness, refractive index, and extinction coefficient in less than a second. The entire desktop system sets up in minutes and can be used by anyone with basic computer skills.
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KLA-TENCOR ALPHA-STEP 200
A sturdy reliable profilometer used for measuring film thickness, step height, and surface morphology located inside our Class 100 cleanroom.
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UV Cure Station
Hg Lamp with long UV wavelengths ideal for curing epoxy or applications requiring prolonged UV exposure. Protective UV shield and glasses available and required while in the immediate vicinity of the station.
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ABM Mask Aligner
Mask aligner used for transferring patterns using either standard UV or Deep UV wavelengths from masks onto substrates. Backside IR alignment capability. Substrates up to 150mm in diameter can be easily accommodated.
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KARL SUSS MJB3 Mask Aligner
Used for aligning masks on wafers with photo-resist. Used for 2 and 3 inch wafers.
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Blanket Expose System
Used for non-critical image transfer and blanket exposure.
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Laurell Spin Coater
A reliable platform used in spin coating primers, photoresists, and polymer coatings located in the lithography area of our Class 100 cleanroom.
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