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This furnace is used for annealing metallized substrates or samples where surface chemical contamination is not an issue. This tube can handle substrates less than 4" in diameter.

Located in our Class 100 cleanroom, the thermal oxidation furnace is primarily used for growing a thermal oxide layer on silicon or annealing clean substrates that have no exposed metal layers. Wafers and substrates less than 5" in diameter can be accommodated. Oxidation is performed at high temperatures of around 1000C either utilizing dry oxygen or wet utilizing a bubbler. No exposed metals are allowed inside the tube.

• Operating Instructions
• Controller Manual
• Lindburg/Blue Manual

The Tempress Low Pressure Chemical Vapor Deposition (LPCVD) system is a modular horizontal furnace designed to process substrates up to 150mm in diameter as part of the semiconductor, optical, MEMS, and solar device manufacturing. It is a 4-stack system set up to deposit silicon nitride, polysilicon, low temperature oxide (LTO), silicon rich oxide (SRO), phosphorus doped LTO, and phosphorus doped polysilicon. All tubes operate independently.

• Nitride Process Checklist
• Quartz Tube Installation Procedure
• Nitride Furnace Consumable Inventory
• Operating Instructions
• Manuals (links to page full of PDFs at mfc.arizona.edu - this will need to be moved)

Located in our Class 100 cleanroom, this system allows for the thermal deposition of metals including Cu, Al, AlSi, In, etc. Deposition occurs under high vacuum. In its current configuration, this system is more suitable for deposition of thin films of more than a hundred nanometers or so.

• Operating instructions (PDF)
• Manual (PDF)

Located in our Class 100 cleanroom, our BOC Edwards Auto 306 is an electron beam evaporation system used for deposition of ultra pure films of metals as well as fused silica. Fully reproducible parameters provide consistent, repeatable deposition results. The most common metals deposited using this system at MFC are Au, Cu, Ti, Cr. System can deposit up to four different materials in series in the same run. This system is most suitable for thin films of a few nanometers to a few microns.

• Operating Instructions
• Ebeam Process Log (Blank)

Electron Beam Manuals

• RV3, RV5, RV8, and RV12 Rotary Vane Pumps Instruction Manual, Issue P (A652-01-880)
• XDS Replacement Tip Seal Kit Instruction Manual, Issue C (A726-01-840)
• XDS Dry Pump Instruction Manual, Issue H (A726-01-880)
• PVEK Valves Instruction Manual, Issue G (C411-02-885)
• Pirani Vacuum Gauges (For use with 500, 1000, 1700, 2000, and 4000) Instruction Manual, Issue D (D021-57-880)
• Penning Vacuum Gauge Heads CP25EK (D145-35-880)
• Auto 306 Accessories: Water Cooled Crystal Holder, Crystal and Oscillator Unit Instruction Manual, Issue A (E086-67-880)
• Auto 306 Vacuum Coater, Volume 2, Instruction Manual, Issue E (E090-02-860)
• Auto 306 Accessories: Rotary Workholder Volume 1 - Installation and Maintenance Instructions, Issue B (E090-49-880, Vol 1)
• Auto 306 Accessories: Rotary Workholder Volume 2 - Operating Instructions, Issue B (E090-49-880, Vol 2)
• Auto 306 Accessories: EB3 Multihearth Electron Beam Source Accessories, Issue A (E090-72-840)
• Auto 306 Accessories: Workholder and Heater Accessories, Volume 1 - Instruction and Maintenance Instructions, Issue F (E090-26-880)
• Auto 306 Accessories: Manual Source Shutter and Electromagnetic Source Shutter, Volume 1 - Instructions and Maintenance Instructions, Issue G (E090-32-880)
• Auto 306 Accessories: EB3 Multihearth Electron Beam Source and Accessories, Volume 1 - Instruction and Maintenance Instructions, Issue F (E090-72-880)
• XT555H Instruction Manual, Issue A (NRA-266-880)
• FTM7 Film Thickness Monitor, Instruction Manual, Issue B (E086-69-880)
• Auto 306 Vacuum Coater with Turbo Molecular Pumping System, Issue G (E090-03-860)
• Seiko STP 301/451 Turbomolecular Pump Series (MT21E003F)
• Neslab Coolflow II Heat Exchanger (Neslab System II)