This furnace is used for annealing metallized substrates or samples where surface chemical contamination is not an issue. This tube can handle substrates less than 4" in diameter.
Located in our Class 100 cleanroom, the thermal oxidation furnace is primarily used for growing a thermal oxide layer on silicon or annealing clean substrates that have no exposed metal layers. Wafers and substrates less than 5" in diameter can be accommodated. Oxidation is performed at high temperatures of around 1000C either utilizing dry oxygen or wet utilizing a bubbler. No exposed metals are allowed inside the tube.
The Tempress Low Pressure Chemical Vapor Deposition (LPCVD) system is a modular horizontal furnace designed to process substrates up to 150mm in diameter as part of the semiconductor, optical, MEMS, and solar device manufacturing. It is a 4-stack system set up to deposit silicon nitride, polysilicon, low temperature oxide (LTO), silicon rich oxide (SRO), phosphorus doped LTO, and phosphorus doped polysilicon. All tubes operate independently.
Located in our Class 100 cleanroom, this system allows for the thermal deposition of metals including Cu, Al, AlSi, In, etc. Deposition occurs under high vacuum. In its current configuration, this system is more suitable for deposition of thin films of more than a hundred nanometers or so.
Located in our Class 100 cleanroom, our BOC Edwards Auto 306 is an electron beam evaporation system used for deposition of ultra pure films of metals as well as fused silica. Fully reproducible parameters provide consistent, repeatable deposition results. The most common metals deposited using this system at MFC are Au, Cu, Ti, Cr. System can deposit up to four different materials in series in the same run. This system is most suitable for thin films of a few nanometers to a few microns.
Electron Beam Manuals
The Verteq Spin Rinse Dryer (SRD) handles 200mm substrates. Wafers are cleaned using DI water and dried with Nitrogen in a static free environment.
Located in our Class 100 cleanroom's lithography area, our double-stacked Semitool SRD will winse wafers to the required resistivity using ultra-pure water and dry wafers using hot UHP N2. The system is currently set up to handle both 100mm and 150mm wafers.
The BOC Edwards Eco-Snow TM cleaning system uses carbon dioxide to clean substrates and surfaces using a specially designed Eco-Snow TM variable orifice jet spray gun. The use of carbon dioxide mitigates the need for the use of toxic and expensive solvents in many cleaning applications. This system is equipped with a nitrogen purged mini-environment (with blower), an electrostatic discharge control system, substrate holder which can be heated, IR lamp, and various nozzle for the CO2 jet spray gun.
