AGS Reactive Ion Etcher (RIE) System
Located in our Cleanroom this system is capable of plasma etching and plasma cleaning substrates as large as 300mm (12") in diameter. It can etch silicon nitride, silicon dioxide, polysilicon, germanium and polymers. It can clean and remove photoresists and organic residues.
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- Operating Instructions
- AGS RIE Manuals
- AGS Plasma System 900 Manual
- Alcatel ACP-15G Dry Pump
- AT-6 Automatic Matching Network
- ENI 600W Backup RF Generator
- Oerlikon TW250S Turbo Pump
- Dressler Cesar 136 600W Supply
- Bay Voltex Tempryte Chiller
- MC2 Matching Network Controller
- Pfeiffer Hi Pace 300C Turbo Brochure
- Proteus Industries Flow Switch
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