Verteq Spin Rinse Dryer (SRD)
The Verteq Spin Rinse Dryer (SRD) handles 200mm substrates. Wafers are cleaned using DI water and dried with Nitrogen in a static free environment.
The Verteq Spin Rinse Dryer (SRD) handles 200mm substrates. Wafers are cleaned using DI water and dried with Nitrogen in a static free environment.
Located in our Class 100 cleanroom's lithography area, our double-stacked Semitool SRD will winse wafers to the required resistivity using ultra-pure water and dry wafers using hot UHP N2. The system is currently set up to handle both 100mm and 150mm wafers.
The BOC Edwards Eco-Snow TM cleaning system uses carbon dioxide to clean substrates and surfaces using a specially designed Eco-Snow TM variable orifice jet spray gun. The use of carbon dioxide mitigates the need for the use of toxic and expensive solvents in many cleaning applications. This system is equipped with a nitrogen purged mini-environment (with blower), an electrostatic discharge control system, substrate holder which can be heated, IR lamp, and various nozzle for the CO2 jet spray gun.