The Kulicke and Soffa 780 dicing saw is a back-end processing tool for cutting wafers or substrates, typically silicon or quartz, into smaller pieces or chips for packaging or further processing.

Some of the features of this tool are:

• Integrated semi-automatic computer controlled precision saw. It is menu driven, with a multi-axis cutting stage with automatic indexing.
• Employs an extremely thin diamond impregnated cutting wheel with water cooling. The 2" wheel is mounted on an air spindle which is driven at speeds up to 32,000rpm.
• The chuck accepts up to 6" diameter wafers.
• Video monitor for online inspection and alignment.
• Capable of cutting a wide variety of materials such as silicon, quartz, metal coated substrates, glass, ceramics, and sapphire.

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• Operating instructions
• Supplemental dicing instructions
• Other references
  • Kulicke & Soffa Dicing Information
  • Asahi Dicing Information
  • Dicing Tape Information