An NFC staff member will conduct a facility specific safety orientation and provide all clients with an overview of safety requirements needed to complete their work in the facility. We are a CSL-3 facility with a number of highly toxic and pyrophoric chemicals required for fabrication stored onsite. Please print and bring a copy of the NFC Safety Orientation Participant Checklist to your appointment.

Prior to your one-on-one safety tour appointment please review link 1 and the summary of rules at link 4 while carefully reviewing the information presented at links 2 and 3 below:

1. Material Safety Data Sheets (MSDS)
2. NFC Emergency Response Guide
3. Chemical Disclosure
4. MFC Safety Rules*

• University of Arizona Chemical Safety Manual*
• Short Video on CO Safety and Detection*
• Pima County Waste Water Ordinance*

Ellipsometer, profilometers, 4 pt probe, Filmetrics & Nanospec for thickness. We have access to a number of SEM/EDX facilities on campus.

E-beam & thermal evaporation.

RF and DC sputtering.

Low pressure and plasma enhanced capabilities to deposit SiN, Poly Si, a-Si, Low Temperature SiO₂ (LTO), n-doped LTO (PSG), n-doped Poly Si, Si Rich Oxide (SRO) on substrates up to 6" in diameter.

Solutions for Dielectrics and Metals, IPEC 372M and 372MU. We also have access to an APD-800 300mm R&D polisher.

A number of different plasma etch/clean systems for a variety of films and treatments. Wet benches and chemicals for a variety of wet etching in both class 10 & class 100 areas. Wafer spin rinse dryers are available. CO₂ cleaner available.

High resolution image transfers on substrates up to 6" in diameter. Frontside/backside alignment capability. Low resolution images on substrates up to 12 square inches.

Located in our Class 100 cleanroom, this tool is used to clean substrates and surfaces using an air, oxygen, or argon low intensity plasma, minimizing the need for expensive/toxic solvents while conditioning the surface for maximum wettability or subsequent thin film adhesion. The low intensity plasma is ideal for surface cleaning at near ambient temperatures. Substrates are placed on a tray inside a cylindrical chamber of around 3" in diameter and 7" long. A vacuum is applied to allow for the creation of the low intensity plasma.

Operating Instructions

Manual